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CIRCUIT CARD ASSEMB

DEPT OF DEFENSE.DEFENSE LOGISTICS AGENCY.DLA AVIATION.DLA AVIATION PHILADELPHIA.DLA AVIATION AT PHILADELPHIA, PA · Response deadline: Mon, 16 Nov 2026

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What the government is buying

The Defense Logistics Agency (DLA) Aviation at Philadelphia is soliciting offers for circuit card assemblies. NAICS 334412 refers to "Bare Printed Circuit Board Manufacturing," though in practice this notice covers the broader assembly work suggested by the title. Circuit card assemblies are essential components in military avionics, communications, and electronic systems, combining populated circuit boards with integrated circuits, connectors, and other electronic components.

This is a standard DLA procurement for the military supply chain. DLA Aviation serves as the primary logistics support for U.S. military aircraft and related systems, procuring parts to maintain operational readiness across the armed services. The specific requirements for this circuit card assembly—quantities, technical specifications, quality standards, and packaging—see the solicitation.

Key facts

Attribute Value
Agency DLA Aviation at Philadelphia, PA (Dept of Defense)
Notice type Solicitation
Solicitation number SPRPA127QXA68
NAICS 334412
Set-aside None (full and open competition)
Response deadline November 16, 2026 at 4:30 PM ET
Place of performance Not provided in metadata—see the solicitation

Who can bid

This solicitation is open to all responsible sources—no small-business set-aside applies. Any qualified manufacturer or supplier, regardless of size, may submit an offer. However, small businesses in electronics manufacturing remain eligible to compete.

To bid, your firm must demonstrate capabilities in electronics assembly, likely including:

Non-traditional defense contractors and commercial electronics firms can compete, though prior DLA or defense experience strengthens credibility. If you lack a CAGE code or SAM registration, you cannot bid—this is non-negotiable.

How to put together a competitive bid

Technical response: Circuit card assemblies require precise manufacturing process documentation. Provide detailed build-to-print capability, test protocols (functional, environmental, in-circuit test), and traceability systems. Highlight any experience with obsolete component sourcing or DMSMS (diminishing manufacturing sources) management—common in military sustainment.

Pricing strategy: Full and open competition typically drives aggressive pricing. Analyze DLA's published historical prices through FPDS or DLA's eTools if available. Consider whether your firm qualifies for small-business price evaluation adjustments on other DLA bids—but not here, given no set-aside.

Past performance: DLA heavily weights delivery reliability and quality history. If new to DLA, emphasize comparable commercial or other federal agency work. Obtain CPARS-compatible references.

Proposal mechanics: DLA Aviation Philadelphia typically requires submission through ASVAC (Aviation Supply VAN Administration Center) or specified electronic means. Verify submission method and any DLA-specific clauses—see the solicitation.

Next steps

Read the full solicitation on SAM.gov using solicitation number SPRPA127QXA68. The complete notice contains technical specifications, delivery requirements, inspection criteria, and exact submission instructions.

Critical deadline: November 16, 2026 at 4:30 PM Eastern Time. DLA strictly enforces deadlines with no grace period for late submissions. Begin SAM.gov registration, CAGE code verification, and technical review immediately if not already prepared.

View the official notice on SAM.gov →

Bidding on this one? Get a bid/no-bid verdict, compliance matrix, capability statement and full proposal first draft for this solicitation in under an hour. Get the bid package ($750) →