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MODULE ASSEMBLY,RIM

DEPT OF DEFENSE.DEFENSE LOGISTICS AGENCY.DLA MARITIME.DLA MARITIME MECHANICSBURG.SPRMM1 DLA MECHANICSBURG · Response deadline: Fri, 29 Jan 2027

What the government is buying

DLA Maritime Mechanicsburg is soliciting for module assembly, rim under solicitation SPRMM126RHB33. This falls under Federal Supply Classification 5998—electrical and electronic assemblies, boards, cards, and associated hardware. The specific nature of the "rim" module assembly suggests this is likely a component for maritime or naval systems, though see the solicitation for exact technical specifications and intended end-use application.

NAICS 334412 specifies bare printed circuit board manufacturing, which indicates this procurement involves fabrication of populated or unpopulated circuit board assemblies rather than complete standalone electronic devices. DLA Maritime supply chain procurements typically support shipboard electronics, navigation, communications, or weapons systems maintenance across Navy and Coast Guard fleets.

Key facts

Who can bid

This is a full and open procurement with no small business set-aside. Any responsible offeror meeting the solicitation's qualifications may compete, including:

• Large businesses and defense contractors with existing DLA supply relationships
• Small businesses in NAICS 334412 or with relevant circuit board manufacturing capabilities
• Nontraditional defense contractors capable of meeting technical and quality requirements

Small businesses should note that without a set-aside, they will compete directly against established defense electronics suppliers. However, DLA Maritime does utilize small business participation goals even in full and open competitions, and subcontracting opportunities may exist for firms lacking full manufacturing capacity.

Key eligibility prerequisites likely include: ITAR/EAR compliance for defense-related electronics, AS9100 or ISO 9001 quality certification (common for DLA suppliers), and demonstrated printed circuit board assembly capability to military specifications. See the solicitation for exact qualification requirements.

How to put together a competitive bid

For bare printed circuit board manufacturing under DLA Maritime, focus on these competitive elements:

Technical compliance: DLA Technical Data Packages typically specify exact board materials, layer counts, trace widths, finishing requirements, and testing protocols. Deviations require explicit approval—bid exactly as specified or submit engineered alternatives through the proper channels.

Past performance: Document comparable DLA, Navy, or other defense PCB contracts. First-time DLA suppliers should highlight relevant commercial aerospace, medical device, or telecommunications work with equivalent quality standards.

Pricing strategy: DLA uses automated best value tradeoff analysis. Understand your true manufacturing costs including gold, copper, and laminate commodity price volatility. Consider DLA's Dynamic Pricing and Evaluation System for historical award data on similar NSNs.

Quality systems: Verify your QSLM (Qualified Suppliers List of Manufacturers) status or initiate qualification if required. MIL-PRF-31032 or MIL-PRF-55110 certification may apply depending on board type.

Delivery and packaging: DLA Maritime requires strict adherence to MIL-STD-2073 packaging and VSM (Vendor Shipment Module) labeling. Factor in these specialized logistics costs.

Next steps

1. Retrieve the full solicitation at SAM.gov using solicitation number SPRMM126RHB33
2. Note the deadline: Proposals due January 29, 2027 at 2:00 PM Eastern Time—DLA strictly enforces deadline with no grace period
3. Review attachments for Technical Data Package, QASP requirements, and any Small Business Subcontracting Plan clauses
4. Register in DLA's procurement systems if not already qualified (requiring active SAM registration, at minimum)

View the official notice on SAM.gov →